EDA

Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.

Siemens has completed the acquisition of Insight EDA, a specialist in circuit-reliability analysis.

Imec has a version of its imec.netzero virtual fab tool accessible to the general public with the aim of showing the environmental impact of IC manufacturing.

Cadence has linked several machine-learning approaches to build a tool that is designed to speed up the detection and diagnosis of on-chip power-integrity issues.

Accellera has published for public review version 0.1 of a standard designed to help pass clock-domain crossing information between EDA tools.

This year’s IEDM features a number of papers that seek to drive down the size and boost the performance of image sensors.

The IEEE Symposium on VLSI Technology & Circuits switches back to Honolulu for its 44th year in the summer of next year and has issued its call for papers, with a deadline of early February for contributions.

Chiplet-based 3DIC designs present new challenges for flows that integrate tasks from design exploration to physical verification.

Accellera ’s board of directors has approved the version 2.1 of the Portable Test and Stimulus Standard.

From tutorials to technical papers to special 'diamond' sessions, Tessent features large at ITC 2023.