Foundry

October 29, 2015
Innovus chip layout

Cadence’s path to digital implementation on 10nm

The 10nm process will see changes to multiple patterning that demands changes in the implementation flow, along with an increased focus on the effects of variability.
September 23, 2015

Mounting Fiji: How AMD realized the first volume interposer

AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
Article  |  Topics: EDA - DFM, DFT, IC Implementation  |  Tags: , , , , , , ,   |  Organizations: , , , ,
July 20, 2015
TSMC finFET

Lessons learned in the finFET trenches

In sessions at the 2015 Design Automation Conference, engineers who had worked on finFET-oriented projects revealed how the technology has changed their design practices and where others may want to think twice about making the move.
October 6, 2014
Power grid signal track blocking

ARM, TSMC design explores 16nm finFET issues

ARM and TSMC used an extensive pre-planning process, including a static analysis of each module's overall logic structure, to put together a 2.3GHz processor design based around ARM's main 64bit Big.Little pairing for the foundry's 16nm finFET process.
Article  |  Topics: EDA - IC Implementation  |  Tags: , , , , ,   |  Organizations: ,
September 18, 2014

Using optimized design flows to meet PPA goals for SoC processor cores

How tuning a design flow can help optimize SoC processor cores for power, performance and area - and make it possible to do different optimisations for different cores on the same SoC.
September 2, 2014
Intel's trigate is among the structures to be modeled by the revised BSIM4

Design enablement and entitlement for 14/16nm finFET processes

How EDA tools are evolving to make it possible to design with finFET processes.
Article  |  Topics: EDA - IC Implementation  |  Tags: , , , ,   |  Organizations: , ,
August 27, 2014
Prasad Saggurti is the product marketing manager for embedded memory IP at Synopsys.

Six key criteria for deciding to migrate to a finFET process

Moving to a finFET process means considering process readiness, cost and yield, as well as the traditional power, performance and area advantages
Expert Insight  |  Topics: EDA - IC Implementation, IP - Selection  |  Tags: , ,   |  Organizations: , , , , ,
July 9, 2014
Intel's trigate is among the structures to be modeled by the revised BSIM4

One BSIM to rule them all

A change in the way the core compact models are developed has accelerated their development and, for the first time, allowed the models to be used not just for circuit simulation but to help guide process evolution as chipmakers play not only with materials but the shape of finFETs.
June 10, 2014
High-speed I/O eye diagram - thumbnail

Zeroing in on the problems of fast board-level interconnect

A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.
April 28, 2014

Protecting IP in a collaborative signoff environment

The encryption chain for today's highly collaborative designs needs to be managed with care.

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