EUV

Gandharv Bhatara looks at how the OPC and RET elements of Calibre are getting ready for the EUV age.

The 10nm process will see changes to multiple patterning that demands changes in the implementation flow, along with an increased focus on the effects of variability.

If EUV is further delayed until 8nm, the industry has to explore other options for patterning, and the effects they will have on the DFM flow.

The costs of advanced lithography techniques at 1xnm, and the yield and reliability risks from the resultant process variation, will stop many companies getting the typical economic advantages of scaling.