Learn how connectivity management solutions help you manage the multiple formats in which 3D IC components are delivered.
More optimistic about the semiconductor industries prospects than for some time, Siemens Joe Sawicki identified key EDA challenges at DAC.
AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
A coordinated design methodology fine-tunes chip-to-package PCB layout and routing that involves high-integration devices.
A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.
MCAD integration provides the means for designers to test the mechanical compatibility of a PCB design – for cooling performance as well as whether the layout will fit into an enclosure without problems.
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