AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
A coordinated design methodology fine-tunes chip-to-package PCB layout and routing that involves high-integration devices.
A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.
MCAD integration provides the means for designers to test the mechanical compatibility of a PCB design – for cooling performance as well as whether the layout will fit into an enclosure without problems.
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