AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
PGA has been IC-centric for mainstream 2D configurations. It must become system-centric for 2.5D and 3D systems.
The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.
A guide to emerging 3D integration techniques for ICs, including a look at various approaches, and some of the tools and standards issues involved.
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