PIM memory boosts efficiency by operating on data without moving it to the CPU but realizing this type of novel technology posed power integration and planning challenges.
AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
'Design for yield' is a familiar term, but the challenges in today's increasingly large projects make a refresher on what it offers particularly timely.
Mobile and networking platforms need high bandwidth, low power consumption, and small footprint. These needs drove standards, such as LPDDR4, Wide I/O 2 and Hybrid Memory Cube.
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