November 4, 2021
PIM memory boosts efficiency by operating on data without moving it to the CPU but realizing this type of novel technology posed power integration and planning challenges.
September 23, 2015
AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
May 30, 2014
'Design for yield' is a familiar term, but the challenges in today's increasingly large projects make a refresher on what it offers particularly timely.
September 24, 2013
Mobile and networking platforms need high bandwidth, low power consumption, and small footprint. These needs drove standards, such as LPDDR4, Wide I/O 2 and Hybrid Memory Cube.