3D-IC presents major connectivity challenges in maintaining a golden netlist and managing necessary exceptions. Learn how to manage them.
3D integration technology has split into a number of different approaches, each of which brings a different combination of benefits in terms of performance.
AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
Innovation in physical verification is driven by incoming nodes but new tools and features can and should be fed back up the technology chain.
FinFET and 3DIC technologies bring with them not just higher performance but an increased need for accurate parasitic analysis.
Parasitic extraction reveals the impact of implementation on the theoretical performance of IC designs.
Monolithic 3DIC integration may provide a viable alternative to conventional 2D scaling for SoCs if manufacturing problems can be overcome.
How to enhance an 'ideal' parastitic extraction strategy to create a full 3D assembly-level parasitic netlist for simulation and circuit analysis.
Fighter pilots have long trusted highly sophisticated automation. That’s how you can meet the challenges posed by advanced PCB design techniques.
PGA has been IC-centric for mainstream 2D configurations. It must become system-centric for 2.5D and 3D systems.
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