Preparing for success at the next node with Calibre
How Mentor develops and works with partners to prepare each version of its Calibre DFM platform to be ready for the introduction of each new process node.
UMC
Enhanced model-based hinting may be the edge you need below 20nm
A detailed dive into how MBH strategies for litho hotspots have been enhanced to deal with double patterning at 20nm and below.
Assessing the true cost of node transitions
John Ferguson reviews the key capital metrics you need to review when deciding whether to move to a new process.
Mounting Fiji: How AMD realized the first volume interposer
AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
Six key criteria for deciding to migrate to a finFET process
Moving to a finFET process means considering process readiness, cost and yield, as well as the traditional power, performance and area advantages
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