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November 20, 2018
Adding system-level, post-layout electrical analysis to HDAP design and verification
Adoption of high-density advanced packaging (HDAP) needs tools and supports to build designers' confidence in the emerging technology.
Article | Topics:
EDA - IC Implementation
,
Verification
| Tags:
2.5D
,
3D
,
foundry
,
HDAP
,
high-density advanced packaging
,
interposer
,
osat
| Organizations:
BEOL
,
Foundry
,
Siemens EDA
September 23, 2015
Mounting Fiji: How AMD realized the first volume interposer
AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
Article | Topics:
EDA - DFM
,
DFT
,
IC Implementation
| Tags:
3DIC
,
advanced packaging
,
DRAM
,
GPU
,
High Bandwidth Memory
,
osat
,
silicon interposer
,
TSV
| Organizations:
AMD
,
Amkor
,
ASE
,
SK Hynix
,
UMC
EDA Topics
DFM
DFT
ESL
IC Implementation
Verification
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