July 9, 2014
A change in the way the core compact models are developed has accelerated their development and, for the first time, allowed the models to be used not just for circuit simulation but to help guide process evolution as chipmakers play not only with materials but the shape of finFETs.
June 10, 2014
A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.
April 28, 2014
The encryption chain for today's highly collaborative designs needs to be managed with care.
August 25, 2013
What ARM learnt when it ran a Mali GPU-based test chip through a Synopsys tool flow onto a TSMC 20nm process
August 12, 2013
3D-IC design is ready for take-off, following several years of intense collaboration to develop the necessary tools, methodologies and flows
April 1, 2013
You can waive some physical verification errors related to legacy IP found in foundry DRC checks. Knowing which has involved lengthy manual analysis. TSMC is enhancing the process with automation.
June 20, 2011
Current shortages could switch in key markets by the end of the year.
June 3, 2011
We quiz TSMC’s Tom Quan on the latest methodological challenges being addressed by the world’s largest foundry’s signature Reference Flow.
December 14, 2010
Morris Chang was in on the ground floor of IC innovation at TI and remains there today as chairman of TSMC. Paul Dempsey reports.
March 1, 2008
In his early days in the semiconductor industry, Morris Chang Morris Chang was one of the “non-Texans” to Texas Instruments and was a manager struggling with the question of how to get individual transistor yields to somewhere around three or even four per cent. One of his colleagues – another immigrant to the Lone Star […]