September 3, 2021
SiP promises advances in transmission speeds, bandwidth, accuracy and low power but verification requires careful evolution of existing tools.
December 31, 2018
A detailed dive into how MBH strategies for litho hotspots have been enhanced to deal with double patterning at 20nm and below.
September 11, 2018
Gandharv Bhatara looks at how the OPC and RET elements of Calibre are getting ready for the EUV age.
February 1, 2018
A new technique has been developed to catch potential new lithography issues when little design data is available for incoming nodes.
October 27, 2017
How to address increasingly complex patterning issues and debug them efficiently as design moves toward 12 and 10nm.
August 30, 2017
Pattern-based design/technology co-optimization (DTCO) estimates lithographic difficulty during the early stages of a new process technology node.
March 22, 2017
The equipment giant's Computational Process Control strategy takes a pragmatic approach to Industry 4.0 and is likely to influence EDA tools for incoming nodes.
March 26, 2015
John Sturtevant looks at ongoing preparations for the incoming node and charts significant progress that has already been made.
January 26, 2015
Precise curved geometries are vital to making this emerging and cost-effective CMOS-based technology work. This primer explains its advantages and how litho tools are evolving to meet the challenges it presents.
August 12, 2014
Sign-off lithography verification is vital as we move beyond double to multi-patterning but changing responsibilities in the flow must be handed with care.