Imec pushes endurance on ferro memory at IEDM
Imec has developed a high-endurance ferroelectric capacitor that could form the basis of storag-class embedded and standalone memories.
Archives
Identifying AI opportunities in PCB design
The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.
Siemens aims to simplify compliance for Linux medical devices
New Quality Package focuses on safety and cybersecurity compliance with EU and US medical device standards.
Real Intent tool looks for glitches
Real Intent has developed a tool to check design and the potential for circuits to glitch.
Semiwise brings cryogenic models to SOI
Semiwise has developed transistor models for the GlobalFoundries 22FDX that cover operation at cryogenic temperatures.
DVCon Europe keynotes focus on connectivity
DVCon Europe's keynotes will examine verification issues in connected cars and 5G networks.
2D advances to take center stage at IEDM
At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.
Arm adds Corellium expertise for IoT to its Virtual Hardware platform
The start-ups virtualization platform has already been gaining traction in comms and security.
Siemens automates test to handle multi-die 2.5D, 3D and 5.5D architectures
Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
Nvidia proposes split-level link for chiplet interconnect
Nvidia revealed at its Fall GTC work the company has done on a bidirectional energy-saving chiplet interconnect that could hit the equivalent of 50Gbit/s per line.