Author Archives: Chris Edwards

About Chris Edwards

Chris Edwards has spent a long time covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology. His work has appeared in a variety of international newspapers including The Guardian, The Daily Telegraph, The Age and the South China Morning Post.
October 7, 2021

Combined database underpins 3DIC design suite

Cadence has built a unified database to support a group of tools to support the planning and implementation of 3DIC designs.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , , ,   |  Organizations:
September 24, 2021

Siemens brings chip-design flow to DARPA Toolbox Initiative

Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , ,   |  Organizations: , , , ,
September 13, 2021

Cadence organizes on-device AI into three families

Cadence has organized its machine-learning platforms into three families intended to cover a wide range of on-device AI applications.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations:
August 31, 2021

Connected cars call for safety islands

A Siemens Tessent white papers examines the role of safety islands in advanced automotive systems.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , ,   |  Organizations:
August 23, 2021

IEDM 2021 publishes course schedule

Aiming for a primarily physical event in the fall, organisers of the 2021 IEDM have published the tutorial and short-core schedule.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations:
August 5, 2021

Keynotes for DVCon Europe announced

DVCon Europe has announced its first two keynote speakers, who will cover the topics of AI and the role of virtualisation in ADAS design and implementation
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: ,
August 2, 2021

DAC and RISC-V move in together at Moscone in December

DAC and the RISC-V Summit will colocate at Moscone West in December, along with Semicon West.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: ,
July 27, 2021

ST makes its first 200mm SiC wafers

STMicroelectronics has made its first silicon carbide wafers that can be run on a 200mm line.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
July 22, 2021

Cadence uses reinforcement learning to tune flow

Cadence has launched a tool that the company claims can speed up implementation by applying machine learning across the flow.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
July 22, 2021

Arm shows off biggest flex processor so far

Arm and flexible-electronics specialist PragmatIC have demonstrated a 32bit processor implemented on a plastic substrate.
Article  |  Topics: Blog - EDA, IP  |  Tags: , ,   |  Organizations: