Author Archives: Chris Edwards

About Chris Edwards

Chris Edwards has spent a long time covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology. His work has appeared in a variety of international newspapers including The Guardian, The Daily Telegraph, The Age and the South China Morning Post.
July 25, 2023

Verification Futures heads to the US in September

Tessolve is bringing its Verification Futures conference to the US with an event scheduled for mid-September.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , , ,
July 24, 2023

Backside power shows promise but more complex manufacturing

Backside power delivery could lead to improvements in chip density and more straightforward place-and-route phases according to work presented at this year’s VLSI Symposium.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , ,
July 20, 2023

Ferroelectric memory moves closer with VLSI experiments

Ferroelectric memory may be able to stage a comeback thanks to materials innovations as work presented at VLSI Symposium have shown, though there is still plenty to do.
July 12, 2023

‘Two wafers are better than one’ for 3D flash

Western Digital's head of technology set out at the recent VLSI Symposium the ways in which flash makers can scale without costs accelerating.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations: ,
July 11, 2023

AI’s possible roles in verification covered at VF2023

The recent Verification Futures Europe conference looked at what AI, from decision trees to foundation models, could do to speed up RTL checks.
July 7, 2023

UK consortium tapes out cryo-SRAM

A UK cryogenic-CMOS research project has taped out its first demonstrator chip for core memory IP expected to be able to operate at close to absolute zero.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations:
July 4, 2023

Co-design underpins infrastructure acceleration at Google

At the recent VLSI Symposium, Google vice president Parthasarathy Ranganathan described the importance of co-design and the software stack in its data-center designs.
June 12, 2023

Air-filled waveguides to cut losses in mass-market radar

AT&S and Imec partnered to develop a way of putting low-loss waveguides into conventional PCBs to support D-band automotive radar and 6G modules.
Article  |  Topics: Blog - PCB  |  Tags: , , , ,   |  Organizations:
June 1, 2023

Semidynamics adds flexible vectors to RISC-V cores

Semidynamics has released a customizable vector unit with out-of-order execution support to accompany its 64bit RISC-V processor cores.
Article  |  Topics: Blog - IP  |  Tags: , , , , ,   |  Organizations:
June 1, 2023

X-Fab introduces BCD-on-SOI at 110nm

X-Fab Silicon Foundries claims to be the first with a foundry offering for 110nm BCD-on-SOI technology, aimed primarily at automotive designers.
Article  |  Topics: Blog - IP  |  Tags: , , , ,   |  Organizations: