MachineWare has expanded its portfolio of high-speed instruction-set simulators to the Arm Cortex-A and -M architectures.
Author Archives: Chris Edwards
Vertical integration is one of the major focus areas at the upcoming IEDM conference, both in terms of transistors and the multiple channels that will go into them.
Siemens and CEA-List have signed a deal under which the two organisations will research the combination of digital-twin and AI.
Ultra Librarian has developed an AI-driven CAD modeling engine that should slash the the time it takes to build component and subsystem models for PCB layout and system design.
Cadence has given its new release of OrCAD access to the cloud-based AI placer designed for its Allegro PCB-layout software.
DVCon Europe has announced its two keynote presentations, focusing on energy-efficient high-performance computing and machine learning.
Accellera has formed a working group to look at the possibility of creating a standard for federated simulation.
Tessolve is bringing its Verification Futures conference to the US with an event scheduled for mid-September.
Backside power delivery could lead to improvements in chip density and more straightforward place-and-route phases according to work presented at this year’s VLSI Symposium.
Ferroelectric memory may be able to stage a comeback thanks to materials innovations as work presented at VLSI Symposium have shown, though there is still plenty to do.