Tech Design Forum
Western Digital
Western Digital
July 12, 2023
‘Two wafers are better than one’ for 3D flash
Western Digital's head of technology set out at the recent VLSI Symposium the ways in which flash makers can scale without costs accelerating.
Article | Topics:
Blog - IP
| Tags:
bonded wafers
,
flash
,
heterogeneous processing
,
monolithic 3DIC
| Organizations:
Kioxia
,
Western Digital
December 11, 2019
Support for RISC-V expands at summit
This week’s RISC-V Summit in California has seen an expansion to the open-source portfolio being built around the architecture as well as increased support from software vendors such as Wind River.
Article | Topics:
Blog - Embedded
,
IP
| Tags:
configurable processors
,
debug
,
open source
,
open-source hardware
,
RISC-V
| Organizations:
Imperas
,
RISC-V Summit
,
UltraSoC
,
Western Digital
,
Wind River
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