Tech Design Forum
Kioxia
Kioxia
July 12, 2023
‘Two wafers are better than one’ for 3D flash
Western Digital's head of technology set out at the recent VLSI Symposium the ways in which flash makers can scale without costs accelerating.
Article | Topics:
Blog - IP
| Tags:
bonded wafers
,
flash
,
heterogeneous processing
,
monolithic 3DIC
| Organizations:
Kioxia
,
Western Digital
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