Blog Topics

Embedded software engineers need to focus on power optimization in their code much earlier and more comprehensively than many of them do today, says Mentor Graphics technologist Colin Walls.

Traditional IP reuse is giving way to configurable, customized cores delivered by semi-automated "IP factory" groups.

20nm design is fraught with problems for analog design but one that causes the biggest headaches is density variation, says Synopsys' Joachim Kunkel.

Tabula expects to have 22nm FPGAs next year and is trying to recruit IP developers to an 'app store' for data-center hardware.

finFETs are vital to the next generation of CMOS processes from Intel, TSMC and others. How will process issues including bulk vs SOI substrates, density limitations, thickness control, and planar device integration affect their practical implementation?

Cadence Design Systems has developed semiconductor IP for the automotive industry's OPEN Alliance to make ethernet the core networking backbone of future motor vehicles.

National Instruments wants to shift the focus for many embedded systems designers away from hardware cost optimization towards graphical programming as a way of reducing the time it takes to get targets up, running and productive.

Chip-design teams are running into problems with verification because they are focused too much on tools and not enough on processes, Mentor Graphics chief scientist Harry Foster explained today at the first of a series of Verification Futures seminars hosted by TVS in Europe this week.

Mentor's Stephen Pateras explains how the proposed IJTAG standard speeds IP test by replacing time-consuming custom and ad hoc methodologies.

The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.