Blog Topics

February 6, 2013

GlobalFoundries inks IP deals

GlobalFoundries has signed deals to let the foundry offer power-saving clocks, a massively parallel floating-point processor and interface IP from Rambus. They are "uncommon solutions" to come from a foundry, the company claims.
February 5, 2013

GlobalFoundries and Samsung talk finFET progress at CPTF

GlobalFoundries and Samsung described how they are readying finFETs for production at CPTF 2013 and how the 28nm processes will have a long shelf life.
Article  |  Tags: , , ,   |  Organizations: , ,
January 30, 2013

Mentor updates HyperLynx for faster boards, more rules checking

Mentor's HyperLynx gets speed and accuracy enhancements, as well as more embedded help, to speed up fast board design
Article  |  Tags: , , ,   |  Organizations:
January 28, 2013

Cadence updates Virtuoso for the 20nm generation

Cadence Design Systems has built into its latest Virtuoso update features designed to tackle the problems of working with the 20nm generation of processes with finer control over layout-dependent effects, double patterning and new types of local interconnect.
January 23, 2013

Future Horizons: prepare for a tight 2014

Even though inventories are slack right, chipmakers could be struggling to find wafers in 2014.
Article  |  Tags: ,   |  Organizations: , ,
January 23, 2013

The silicon industry’s crunch time

Future Horizon’s forecast meeting for the first half of 2013 made it clear how the electronics sector and the semiconductor industry in particular is facing big problems.
Article  |  Tags: , ,   |  Organizations: , ,
January 18, 2013

Remembering Colin Holland

The respected electronics journalist and our friend passed away this Thursday at 59.
Article  |  Tags:
December 21, 2012

Samsung lines up tool providers for finFET tapeouts

14nm finFET test-chip designs are moving through Samsung's fab as ARM, Cadence Design Systems and Synopsys continue to check their flows on the new process.
December 18, 2012

DATE conference prepares program for March

In 2013, the Design Automation and Test in Europe (DATE) conference returns to Grenoble, France and with focus days on the Internet of Things and the cloud.
Article  |  Tags: , , ,   |  Organizations:
December 13, 2012

3D-IC integration prospects improving, say IEDM researchers

3D-IC integration techniques such as the use of TSVs, die stacking and interposers are unlikely to limit performance, according to research from TSMC and IBM
Article  |  Tags: , , , , , ,   |  Organizations: ,