Blog Topics

June 25, 2014

Don’t just whine – it’s time for you to help shape DAC 2015

Any conference can only be as good as the feedback it gets. And next year's DAC team is actively looking for yours. It'll be worth your time.
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June 25, 2014

Accellera releases version 1.2 of UVM

Accellera has released the latest version of the Universal Verification Methodology (UVM) class reference document, with additions to the way in which testbenches can handle messages and registers.
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June 20, 2014

14nm FD-SOI pushes strain and body bias for power savings

At the VLSI Technology Symposium a team led by STMicroelectronics described the techniques used for the upcoming 14nm FD-SOI to boost speed and density over the 28nm version.
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June 13, 2014

Path to 5nm plotted at DAC panel

Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
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June 12, 2014

Internet of Things: an opportunity, but for whom?

Building the internet of Things will demand collaboration and a healthy ecosystem
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June 10, 2014

Verilog-AMS release adds to power-aware analog modeling

Accellera has published version 2.4 of the Verilog-AMS standard for mixed-signal modeling and verification as the group works on a merger of the language with SystemVerilog.
June 9, 2014

Applications won’t find all the bugs, but they have their uses

Can applications provide useful input for verification? They can but not when run straight out of the box, panelists at DAC 2014 said.
June 7, 2014

Intel’s security architect lays out protection plan

At DAC 2014, Intel’s chief security architect Ernie Brickell described the processor maker’s approach to protecting hardware and software from hacks and attacks.
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June 6, 2014

eSilicon to cut costs of ASIC development for IoT, other markets

Online portals enable ASIC designers to explore IP and delivery options, enabling lower-cost markets such as IoT
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June 5, 2014

3D and EDA need to make up for Moore’s Law, says Qualcomm

Qualcomm is looking to monolithic 3D and smart circuit architectures to make up for the loss of traditional 2D process scaling as wafer costs for advanced nodes continue to increase.
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