Applied Materials and CEA-Leti have expanded their collaboration with the creation of a joint lab to develop materials useful for sensors, RF communications, and power devices, and with a focus on heterogeneous integration.
Nvidia's move into software aimed at mask production and EDA looks to be part of a wider shift to improve yields.
Aki Fujimura of mask specialist D2S sees curved shapes as key to improving die yield and performance but it needs EDA support.
Non-volatile alternatives to flash are finally moving out of the lab as Applied Materials launches production tools and Arm starts pushing MRAM.
AI, its system design implications and its impact on EDA tools themselves will be a key theme for ES Design West next month.
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
The semiconductor industry is reaching a crunch point at which companies that form it have to work together much more closely, says Malcolm Penn of Future Horizons.
TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.
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