Equipment


September 4, 2019

Future memories not so future any more

Non-volatile alternatives to flash are finally moving out of the lab as Applied Materials launches production tools and Arm starts pushing MRAM.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , , , ,   |  Organizations: , ,
June 13, 2019

The road to ES Design West: AI

AI, its system design implications and its impact on EDA tools themselves will be a key theme for ES Design West next month.
July 9, 2015

IBM and friends at 7nm: breakthrough or science project?

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
September 11, 2014

TSMC: e-beam winning on cost over EUV for lithography

EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: , , , , , , ,   |  Organizations: , , ,
June 13, 2014

Path to 5nm plotted at DAC panel

Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
Article  |  Topics: Conferences, Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , , ,
October 4, 2012

IEF: “Industry will have to cooperate”

The semiconductor industry is reaching a crunch point at which companies that form it have to work together much more closely, says Malcolm Penn of Future Horizons.
Article  |  Topics: Commentary, Conferences, Design to Silicon, Blog - EDA  |  Tags: , ,   |  Organizations: ,
August 6, 2012

TSMC joins Intel as ASML investor to accelerate availability of EUV, 450mm lithography

TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.
Article  |  Topics: Commentary, Design to Silicon  |  Tags: , ,   |  Organizations: , ,

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