Chipmaker

March 4, 2020

CEVA splits vectors for more efficient 5G

CEVA has reworked its XC architecture to provide what the company claims is the kind of performance boost needed to handle phase-two 5G applications once Release 17 rolls out.
Article  |  Topics: Blog - IP  |  Tags: , , , ,   |  Organizations:
February 28, 2020

Learn how Renesas uses SLEC to enhance its verification flows

A new technical article discusses Renesas' addition of SLEC to its SystemC and RTL flows and the improvements it achieved in time and coverage..
Article  |  Topics: Blog - EDA, - HLS  |  Tags: , , ,   |  Organizations: ,
February 12, 2020

AI processor company opts for Analog FASTSPICE and Symphony

Mythic will use the Mentor tools for its analog-targeted intelligence processing units.
February 10, 2020

Arm adds AI to Cortex-M cores

Arm has launched a pair of cores intended to bring acceleration for machine learning to its Cortex-M series of processors.
Article  |  Topics: Blog - IP  |  Tags: , ,   |  Organizations:
January 24, 2020

SureCore provides 30-day test for SRAM compiler

SureCore has started running 30-day trials of its low-power memory compiler.
Article  |  Topics: Blog - IP  |  Tags: , , , ,   |  Organizations:
January 19, 2020

Verific celebrates two decades of parser pre-eminence

The parser specialist has built a loyal fanbase across the electronics system design infrastructure with users now lining up to mark its 20th birthday.
Article  |  Topics: Blog - EDA, - Tool development  |  Tags: ,   |  Organizations: , , , , ,
January 10, 2020

MRAM pushes speed and endurance at IEDM

IEDM late last year showed how MRAM is being prepared for both FD-SOI and advanced finFET nodes.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations: , , ,
January 7, 2020

Siemens and Arm combine to extend digital twin further into SoC design

Partnership combines Siemens PAVE 360 digital twin with ARM IP, including dedicated automotive offerings, to speed and streamline design toward Level 5.
Article  |  Topics: Digital Twin, Blog - EDA, IP, PCB  |  Tags: , , , ,   |  Organizations: , ,
December 18, 2019

On-demand DRC within P&R cuts closure time in half for MaxLinear

Case study describes how RF/AMS specialist used Calibre RealTime Digital within its flow for a high-end DSP SoC.
December 16, 2019

Mentor delivers eMRAM test for ARM/Samsung FDSOI at 28nm

Tessent test suite targets automotive, AI and IoT projects that need embedded non-volatile memory.

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