Research institute Leti and Soitec have decided to team up to work on a new generation of engineered substrates, such as specialized silicon-on-insulator (SOI) wafers.
The deal includes the launch of a prototyping hub and pilot line intended to provide access for partners to early exploration and analysis. The Substrate Innovation Center is to be located on Leti’s campus and will be staffed by Leti and Soitec engineers. The main targets for the engineered substrates are 4G/5G connectivity, artificial intelligence, sensors and display, automotive, photonics, and edge computing.
“Leti and Soitec’s collaboration on SOI and differentiated materials, which extends back to Soitec’s launch in 1992, has produced innovative technologies that are vital to a wide range of consumer and industrial products and components,” said Emmanuel Sabonnadière, Leti CEO. “This new common hub at Leti’s campus marks the next step in this ongoing partnership. By jointly working with foundries, fabless, and system companies, we provide our partners with a strong edge for their future products.”