October 17, 2022
At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.
October 6, 2022
The start-ups virtualization platform has already been gaining traction in comms and security.
September 27, 2022
Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
September 21, 2022
Nvidia revealed at its Fall GTC work the company has done on a bidirectional energy-saving chiplet interconnect that could hit the equivalent of 50Gbit/s per line.
September 21, 2022
Agile Analog has launched its own digital standard cell library, designed to be used in the control circuits for analog blocks that form the IP company’s main offering.
September 15, 2022
Cadence has brought the inputs for its AI-driven tools under the umbrella of a big-data collection platform and added functional verification to the list of products that use machine learning.
September 14, 2022
X-Fab is using IHP technology to add a 130nm silicon germanium process to its offering.
September 8, 2022
The system-in-package and module trends in system design promote bringing together physical (DRC) and electrical (LVS) verification.
September 8, 2022
Equivalence checking supports the efficient reuse of designs that reside on out-of-date silicon but remain valid in their own right.
September 5, 2022
5G IC designs have needed aggressive innovation across many elements and more use of FD-SOI that both pose parasitic extraction challenges.