Tech Design Forum Briefing


Briefing Authors

Paul Dempsey

Paul Dempsey Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.

Luke Collins

Luke Collins Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.

Chris Edwards

Chris Edwards Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
October 17, 2022

2D advances to take center stage at IEDM

At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.

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October 6, 2022

Arm adds Corellium expertise for IoT to its Virtual Hardware platform

The start-ups virtualization platform has already been gaining traction in comms and security.

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September 27, 2022

Siemens automates test to handle multi-die 2.5D, 3D and 5.5D architectures

Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.

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September 21, 2022

Nvidia proposes split-level link for chiplet interconnect

Nvidia revealed at its Fall GTC work the company has done on a bidirectional energy-saving chiplet interconnect that could hit the equivalent of 50Gbit/s per line.

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September 21, 2022

Agile Analog adds digital library for easier porting

Agile Analog has launched its own digital standard cell library, designed to be used in the control circuits for analog blocks that form the IP company’s main offering.

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September 15, 2022

Cadence extends AI to verification data with unified database

Cadence has brought the inputs for its AI-driven tools under the umbrella of a big-data collection platform and added functional verification to the list of products that use machine learning.

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September 14, 2022

X-Fab to add 130nm SiGe with IHP deal

X-Fab is using IHP technology to add a 130nm silicon germanium process to its offering.

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September 8, 2022

Module verification demands integrated DRC and LVS

The system-in-package and module trends in system design promote bringing together physical (DRC) and electrical (LVS) verification.

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September 8, 2022

Use equivalence checking to retarget obsolete FPGA designs

Equivalence checking supports the efficient reuse of designs that reside on out-of-date silicon but remain valid in their own right.

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September 5, 2022

Parasitic extraction challenges intensify for 5G

5G IC designs have needed aggressive innovation across many elements and more use of FD-SOI that both pose parasitic extraction challenges.

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