A new version of automotive safety standard ISO 26262 is due in 2018 but how close to Level 5 autonomy will it actually take us? And what about security?
The ESD Alliance is relaunching the annual panel session featuring CEOs from ARM, Cadence Design Systems, Mentor Graphics and Synopsys in Mountain View on April 9.
German industrial conglomerate to pay $4.5B to extend its PLM division into electronic chip and systems design.
Microsoft has launched an OEM version of the Windows Holographic platform it has developed for its own AR headset, the HoloLens.
But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
Open-source hardware, in-field configurability, and a hardware-plus-services approach could protect margins as the IoT hammers down costs, says GSA report.
Driving down energy consumption for the IoT, making portable stimulus deliver real benefits and the practical benefts of a globalizing DVCon.
But the bridge standard's European backers still need greater support from the big EDA vendors.
...and why the semiconductor industry hasn't been singularitied down to one MegaSemis Inc even if that's what M&A data suggests.
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
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