Commentary

June 1, 2016

Computex 2016: Microsoft makes play to be the VR OS

Microsoft has launched an OEM version of the Windows Holographic platform it has developed for its own AR headset, the HoloLens.
April 7, 2016

SNUG 2016: Intel, TSMC, GloFo back post-finFET research at UC Berkeley

But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
March 11, 2016

GSA on how to reinvigorate silicon business models

Open-source hardware, in-field configurability, and a hardware-plus-services approach could protect margins as the IoT hammers down costs, says GSA report.
December 18, 2015

Accellera and Mentor’s Dennis Brophy talks standards targets and DVCon

Driving down energy consumption for the IoT, making portable stimulus deliver real benefits and the practical benefts of a globalizing DVCon.
November 12, 2015

DVCon Europe: UVM-SystemC backers ready first draft

But the bridge standard's European backers still need greater support from the big EDA vendors.
October 12, 2015

Mentor’s Wally Rhines on M&A ‘merger mania’

...and why the semiconductor industry hasn't been singularitied down to one MegaSemis Inc even if that's what M&A data suggests.
July 9, 2015

IBM and friends at 7nm: breakthrough or science project?

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
July 8, 2015

Remembering Gary Smith

The leading EDA analyst passed away late last week after a short illness. Graham Bell offers this remembrance.
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June 10, 2015

TSMC adds Cadence and Imagination subsystems for IoT

Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.
June 9, 2015

COMPUTEX 2015: Wrap II – New customers

Electronics design needs to cope with a combination of major brands and tiny start-ups looking to exploit its skills even where their resources are thin.
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