Commentary

April 16, 2014

Verification perspectives: the growth of emulation

The first in a series of articles on how various vendors are addressing the flow's most challenging task looks at Mentor's strategy for emulation.
February 6, 2014

Cadence to buy Forte and build out HLS offering

EDA giant cites high-level synthesis' move into the mainstream as driven by IP integration challenges in striking deal for the HLS market leader.
December 16, 2013

TSMC hints at glass interposer for mobile SoCs

Glass may be the high frequency interposer option given silicon concerns about power and noise. TSMC adds another pathfinder to its 3D arsenal.
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December 16, 2013

Qualcomm’s take on preserving Moore’s Law economics

Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.
December 10, 2013

Graphene gets a reality check

A leading researcher argues that graphene will not replace but complement silicon and thrive in specialist applications.
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November 13, 2013

TSMC succession plan emphasizes stability

TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
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November 7, 2013

TSMC demonstrates readiness for 3D-IC

Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
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November 4, 2013

Rambus CEO calls for collaboration and an architectural focus for memory

Dr Ron Black also discussed his experiences with the Internet of Things in a lively keynote at the GSA Memory+ Conference in Taipei
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November 4, 2013

Amkor keeps question mark next to ‘full’ 3D-IC in 2016

Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
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October 11, 2013

India outlines subsidies for foundry fab plan

The Indian government will meet up to a quarter of initial capital costs for a foundry capable of nodes up to 45nm and 40,000 wafer starts per month at 300mm.
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