TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
Dr Ron Black also discussed his experiences with the Internet of Things in a lively keynote at the GSA Memory+ Conference in Taipei
Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
The Indian government will meet up to a quarter of initial capital costs for a foundry capable of nodes up to 45nm and 40,000 wafer starts per month at 300mm.
To get others to adopt its GPU cores, Nvidia must quickly build partnerships with tool vendors and foundries that guarantee easy implementation.
And then bear in mind that the father of telephony is telling all design engineers a cautionary tale: Documentation. Documentation. Documentation.
Half the price, a 1GHz processor, 2GB of integrated storage and some 'interesting' plug-in capes. All for $45. Let the wild Linux-Making begin.
With both now more dependent on foundry business for their finFET (trigate) and FDSOI offerings, DATE was a chance to push their innovations in low power.
Docea Power extends power and thermal analysis tools to address complexity and sub-dividing responsibilities among architects.
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