EDA

Packetized test and three new technologies provide the core of the company's DFT presentations during the virtual International Test Conference running this week.

Cadence has built a unified database to support a group of tools to support the planning and implementation of 3DIC designs.

Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.

A Siemens Tessent white papers examines the role of safety islands in advanced automotive systems.

Aiming for a primarily physical event in the fall, organisers of the 2021 IEDM have published the tutorial and short-core schedule.

A DVCon technical paper addresses potential reset domain crossing metastability issues due to UPF instrumentation.

DVCon Europe has announced its first two keynote speakers, who will cover the topics of AI and the role of virtualisation in ADAS design and implementation

DAC and the RISC-V Summit will colocate at Moscone West in December, along with Semicon West.

A Siemens white paper describes a way of automatically deriving information from 2.5D/3DIC designs to streamline latchup design-rules verification.

STMicroelectronics has made its first silicon carbide wafers that can be run on a 200mm line.