Archives

December 17, 2020

Macronix proposes 3D to breathe life back into NOR flash

At IEDM this year, Macronix showed how a 3D architecture may bring back NOR flash, which stopped scaling a decade ago.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations:
December 15, 2020

Chipmaking’s new environment presented at IEDM

Imec's senior vice president of CMOS outlined future directions for the technology over the coming decade.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations:
December 14, 2020

Mentor rebrands as Siemens EDA

Mentor, a Siemens business, has rebranded as Siemens EDA, almost almost four years after the EDA company was acquired.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , ,   |  Organizations:
December 11, 2020

OSVVM updates go into Riviera-Pro

Aldec updates tools to add support for the latest release of the VHDL verification methodology.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
December 4, 2020

Analog surges as cause of IC respins (Wilson Functional Verification 2020 – Part Three)

Study may point to new challenges in more bidirectional AMS implementations on SoC-class designs, though formal and emulation help keep respin count in check.
December 1, 2020

Less than one-in-five FPGA projects avoid bug escapes (Wilson Functional Verification 2020 – Part Two)

Benchmark study detects correlation between maturity of verification processes and the quality of designs when they reach production.
November 27, 2020

RISC-V in nearly a quarter of designs (Wilson Functional Verification 2020 – Part One)

Use of the open-source RISC-V processor was tracked for the first time by the biennial study, finding notably high take-up.
November 19, 2020

Version 2 draft of portable stimulus standard goes up for public review

Accellera Systems Initiative has published for open review version 2.0 of the Portable Test and Stimulus standard.
Article  |  Topics: Blog - EDA  |  Tags: ,   |  Organizations:
November 9, 2020

IEDM 2020 highlights transistor and interconnect advances

This year's IEDM will feature papers that exploit stacked nanoribbons to reduce CMOS footprint, graphene interconnects that support easier integration, and the variability prospects of 2D semiconductors.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , ,
November 3, 2020

Showing ‘equivalence’ to seed digital twin adoption

A partnership between Siemens and VSI, a real-world autonomous vehicle research company, aims to refine and promote digital twin strategies.
Article  |  Topics: Digital Twin, Verification  |  Tags: , , , , , , ,   |  Organizations: