January 27, 2021
Electrostatic discharge verification is becoming increasingly hard to achieve but automated pre-loaded checks can now help.
January 22, 2021
Virtual strategies make for greater productivity and widen the number of emulation use cases. A new paper considers some of the most popular examples.
January 20, 2021
Pent-up demand and mis-timed capacity investment could cause rapid IC industry growth.
January 19, 2021
Design-services company Sondrel is recommending teams start earlier on package design to avoid delays after IC tapeout.
January 15, 2021
The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
January 14, 2021
Originally presented at DVCon Europe, a new paper automates complex steps in RDC verification and reduces noise.
December 21, 2020
Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
December 18, 2020
Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.
December 18, 2020
Computational storage devices are posing a new raft of challenges that is being addressed using a powerful pre-silicon methodology.
December 17, 2020
Arm is pushing more work onto Arm servers in the AWS cloud as it encourages EDA vendors to port their tools to the architecture.