foundry

September 11, 2014

TSMC: e-beam winning on cost over EUV for lithography

EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: , , , , , , ,   |  Organizations: , , ,
July 4, 2014

Qualcomm takes 28nm to China in SMIC deal

Chinese foundry Semiconductor Manufacturing International Corporation (SMIC) is to get a helping hand to develop a production-class 28nm process from Qualcomm Technologies.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
April 15, 2014

Common Platform foundry alliance to be wound down

But some research and process collaboration is set to continue in the background as Samsung, GlobalFoundries and IBM chart their own priorities.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
March 27, 2014

Intel and Altera extend foundry deal into interposer and full 3D

Deal quashes rumors that Altera was about to move its cutting edge production back to TSMC, but nor does it appear to be 'exclusive' for 3D products.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: , , , , ,   |  Organizations: , ,
November 13, 2013

TSMC succession plan emphasizes stability

TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
Article  |  Topics: Commentary, Design to Silicon  |  Tags: , , , , , , , ,   |  Organizations: , , ,
October 11, 2013

India outlines subsidies for foundry fab plan

The Indian government will meet up to a quarter of initial capital costs for a foundry capable of nodes up to 45nm and 40,000 wafer starts per month at 300mm.
Article  |  Topics: Blog Topics, Commentary, Design to Silicon  |  Tags: , ,   |  Organizations: ,
September 11, 2013

Intel tips 14nm processor, Quark core and SoC licensing plans

In a keynote at the Intel Developer Forum, CEO Brian Krzanich said the company would start making 14nm processors by the year end and confirmed intel would license SoC designs to be fabbed by other companies.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , , ,   |  Organizations:
May 29, 2013

TSMC and Xilinx forge tighter bonds to speed up finFET port

Xilinx and TSMC are forming a single engineering team to accelerate development of a family of finFET-based field programmable gate arrays (FPGAs).
Article  |  Topics: Blog - EDA, Embedded, PCB  |  Tags: , , ,   |  Organizations: ,
March 27, 2013

Intel and ST stake claims to foundry low power designs

With both now more dependent on foundry business for their finFET (trigate) and FDSOI offerings, DATE was a chance to push their innovations in low power.
February 26, 2013

Intel foundry to make Altera FPGAs

Intel's announcement that it will make FPGAs for Altera in an upcoming 14nm finFET process will reshape the programmable logic, and foundry, businesses.
Article  |  Topics: Blog Topics, General  |  Tags: , ,   |  Organizations: ,

PLATINUM SPONSORS

Synopsys Cadence Design Systems Siemens EDA
View All Sponsors