Intel and Altera extend foundry deal into interposer and full 3D
Deal quashes rumors that Altera was about to move its cutting edge production back to TSMC, but nor does it appear to be 'exclusive' for 3D products.
foundry
TSMC succession plan emphasizes stability
TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
India outlines subsidies for foundry fab plan
The Indian government will meet up to a quarter of initial capital costs for a foundry capable of nodes up to 45nm and 40,000 wafer starts per month at 300mm.
Intel tips 14nm processor, Quark core and SoC licensing plans
In a keynote at the Intel Developer Forum, CEO Brian Krzanich said the company would start making 14nm processors by the year end and confirmed intel would license SoC designs to be fabbed by other companies.
TSMC and Xilinx forge tighter bonds to speed up finFET port
Xilinx and TSMC are forming a single engineering team to accelerate development of a family of finFET-based field programmable gate arrays (FPGAs).
Intel and ST stake claims to foundry low power designs
With both now more dependent on foundry business for their finFET (trigate) and FDSOI offerings, DATE was a chance to push their innovations in low power.
Intel foundry to make Altera FPGAs
Intel's announcement that it will make FPGAs for Altera in an upcoming 14nm finFET process will reshape the programmable logic, and foundry, businesses.
Future Horizons: prepare for a tight 2014
Even though inventories are slack right, chipmakers could be struggling to find wafers in 2014.
EDA and IP vendors roll out support for TSMC’s 20nm, 3DIC processes
IP and EDA vendors line up to support TSMC 20nm process, CoWoS 3DIC technology
IEF: Achronix plans embedded FPGA push
Achronix plans to use the FPGA fabric that it has developed for standalone products to be fabbed through Intel as the springboard for an embedded-FPGA offering.
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