TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
The Indian government will meet up to a quarter of initial capital costs for a foundry capable of nodes up to 45nm and 40,000 wafer starts per month at 300mm.
In a keynote at the Intel Developer Forum, CEO Brian Krzanich said the company would start making 14nm processors by the year end and confirmed intel would license SoC designs to be fabbed by other companies.
Xilinx and TSMC are forming a single engineering team to accelerate development of a family of finFET-based field programmable gate arrays (FPGAs).
With both now more dependent on foundry business for their finFET (trigate) and FDSOI offerings, DATE was a chance to push their innovations in low power.
Intel's announcement that it will make FPGAs for Altera in an upcoming 14nm finFET process will reshape the programmable logic, and foundry, businesses.
Even though inventories are slack right, chipmakers could be struggling to find wafers in 2014.
IP and EDA vendors line up to support TSMC 20nm process, CoWoS 3DIC technology
Achronix plans to use the FPGA fabric that it has developed for standalone products to be fabbed through Intel as the springboard for an embedded-FPGA offering.
The specialist AMS foundry Triad Semiconductor has married its ViaASIC drag and drop libraries to Mentor Graphics' SystemVision design environment.
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