foundry

November 13, 2013

TSMC succession plan emphasizes stability

TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
Article  |  Topics: Commentary, Design to Silicon  |  Tags: , , , , , , , ,   |  Organizations: , , ,
October 11, 2013

India outlines subsidies for foundry fab plan

The Indian government will meet up to a quarter of initial capital costs for a foundry capable of nodes up to 45nm and 40,000 wafer starts per month at 300mm.
Article  |  Topics: Blog Topics, Commentary, Design to Silicon  |  Tags: , ,   |  Organizations: ,
September 11, 2013

Intel tips 14nm processor, Quark core and SoC licensing plans

In a keynote at the Intel Developer Forum, CEO Brian Krzanich said the company would start making 14nm processors by the year end and confirmed intel would license SoC designs to be fabbed by other companies.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , , ,   |  Organizations:
May 29, 2013

TSMC and Xilinx forge tighter bonds to speed up finFET port

Xilinx and TSMC are forming a single engineering team to accelerate development of a family of finFET-based field programmable gate arrays (FPGAs).
Article  |  Topics: Blog - EDA, Embedded, PCB  |  Tags: , , ,   |  Organizations: ,
March 27, 2013

Intel and ST stake claims to foundry low power designs

With both now more dependent on foundry business for their finFET (trigate) and FDSOI offerings, DATE was a chance to push their innovations in low power.
February 26, 2013

Intel foundry to make Altera FPGAs

Intel's announcement that it will make FPGAs for Altera in an upcoming 14nm finFET process will reshape the programmable logic, and foundry, businesses.
Article  |  Topics: Blog Topics, General  |  Tags: , ,   |  Organizations: ,
January 23, 2013

Future Horizons: prepare for a tight 2014

Even though inventories are slack right, chipmakers could be struggling to find wafers in 2014.
Article  |  Topics: Blog - EDA  |  Tags: ,   |  Organizations: , ,
October 16, 2012

EDA and IP vendors roll out support for TSMC’s 20nm, 3DIC processes

IP and EDA vendors line up to support TSMC 20nm process, CoWoS 3DIC technology
October 4, 2012

IEF: Achronix plans embedded FPGA push

Achronix plans to use the FPGA fabric that it has developed for standalone products to be fabbed through Intel as the springboard for an embedded-FPGA offering.
Article  |  Topics: Conferences, Design to Silicon, Blog - EDA, - General  |  Tags: , , , ,   |  Organizations: , ,
April 2, 2012

Mixed-signal for the rest of us from Triad

The specialist AMS foundry Triad Semiconductor has married its ViaASIC drag and drop libraries to Mentor Graphics' SystemVision design environment.

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