Future Horizons: prepare for a tight 2014
Even though inventories are slack right, chipmakers could be struggling to find wafers in 2014.
foundry
EDA and IP vendors roll out support for TSMC’s 20nm, 3DIC processes
IP and EDA vendors line up to support TSMC 20nm process, CoWoS 3DIC technology
IEF: Achronix plans embedded FPGA push
Achronix plans to use the FPGA fabric that it has developed for standalone products to be fabbed through Intel as the springboard for an embedded-FPGA offering.
Mixed-signal for the rest of us from Triad
The specialist AMS foundry Triad Semiconductor has married its ViaASIC drag and drop libraries to Mentor Graphics' SystemVision design environment.
Technical Newsletter #1: Common Platform, Samsung, ARM, Cadence
Our first email newsletter previews next month's Common Platform Technology Forum 2012 and features exclusive interviews with senior staff at Samsung, ARM and Cadence Design Systems.
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