Manufacturing group SEMI expects fab owners to boost 300mm capacity to an all-time high of 9.6 million wafers per month by the end of 2026 and despite a slowdown in expansion plans this year.
“While the pace of the global 300mm fab capacity expansion is moderating, the industry remains squarely focused on growing capacity to meet robust secular demand for semiconductors,” said Ajit Manocha, SEMI president and CEO. “The foundry*, memory and power sectors will be major drivers of the new record capacity increase expected in 2026.”
Chipmakers leading the expansion in capacity include GlobalFoundries, Hua Hong Semiconductor, Infineon, Intel, Kioxia, Micron, Samsung, SK Hynix, SMIC, STMicroelectronics, Texas Instruments, TSMC, and UMC. Combined, the companies are planning 82 new facilities and lines that will start operation by the end of 2026.
Image SEMI's prediction for 300mm growth to 2026
Due to US export controls, China will continue to focus government investments on mature technology to lead in 300mm front-end fab capacity, increasing its global share from 22 per cent in 2022 to 25 per cent in 2026, reaching 2.4 million wafers per month, the SEMI 300mm Fab Outlook to 2026 claims.
Korea’s worldwide 300mm fab capacity share is expected to slip from 25 per cent to 23 per cent from 2022 to 2026 on weak demand in the memory market. Taiwan is on track to retain third place despite a slight dip in share from 22 per cent to 21 per cent during the same period, while Japan’s share of worldwide 300mm fab capacity is also expected to edge down, from 13 per cent last year to 12 per cent in 2026, as competition with other regions increases.
Powered by strong demand in the automotive segment and government investment, the Americas and Europe will see small increases in share of 300mm capacity over the next few years. The Americas’ global share of 300mm capacity is forecast to rise by 0.2 per cent to nearly 9 per cent by 2026. Europe & Mideast is projected to increase its capacity share from 6 per cent to 7 per cent. Southeast Asia is expected to maintain its 4 per cent share of 300mm front-end fab capacity during the same period.
One of the biggest shifts will be in analog and power as manufacturers move from 200mm to 300mm lines, driving capacity growth of 30 per cent CAGR from 2022 to 2026, followed by foundry at 12 per cent, opto at 6 per cent, and memory at 4 per cent.