Blog Topics

June 10, 2015

SoC verification ‘should use software more’

Verification of SoCs can't be done by adapting IP-level strategies - it'll take a much greater interaction with software, and the use of a shared language
June 10, 2015

TSMC adds Cadence and Imagination subsystems for IoT

Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.
June 9, 2015

Debug life cycle expands with on-chip infrastructure

By widening the range of resources that can be tracked within an SoC, Ultrasoc says it has uncovered ways to make debug a long-term tool for complex multicore designs.
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June 9, 2015

Cloud EDA service gears up for commercial projects

Silicon Cloud is preparing to expand access to its network-based design environment beyond the universities using it today to commercial users
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June 9, 2015

COMPUTEX 2015: Wrap II – New customers

Electronics design needs to cope with a combination of major brands and tiny start-ups looking to exploit its skills even where their resources are thin.
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June 8, 2015

Smart lenses getting closer to live use

Google has moved to on-body tests of the the smart-lens platform it has been developing for the past few years while the team continues to experiment with embedded LEDs that react to blinks to help warn diabetes sufferers of sudden changes in glucose levels.
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June 8, 2015

Formal integration enhances bug-hunting for Cadence

Following the acquisition of Jasper Design Automation last year, Cadence Design Systems is widening the target base of applications for formal verification, covering tasks from bug hunting through accelerated simulation to 'superlinting'.
June 8, 2015

CEA-Leti adds partners to FD-SOI low-power design centre

Silicon Impulse program adds partners to ease industrialisation of ultra-low power IC designs based on FD-SOI processes
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June 8, 2015

Altera boosts density and pipelining in finFET FPGA shift

Altera is using a combination of Intel's 14nm process technology and multidie packaging to boost the logic-cell count for its FPGAs, together with a superpipelining strategy to help balance area and clock speed.
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June 8, 2015

DTCO tool aims to squeeze more out of older processes

Gold Standard Simulations (GSS) has launched a tool intended to help fabless chipmakers squeeze more out of existing processes rather than accept the risk and expense of moving to more advanced, finFET-based processes.
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