Systems

AMD worked with Microsoft and Azure to cut DRC runtimes and control memory usage for a 7nm cloud-based design.

Papers presented at the recent IRPS conference showed the growing importance of lifetime monitoring to the problem of handling components as they age.

Wire harness implementations already face tough margins and increasing design pressure from markets such as automotive. Here's how tools can help.

Partnership combines Siemens PAVE 360 digital twin with ARM IP, including dedicated automotive offerings, to speed and streamline design toward Level 5.

This week’s RISC-V Summit in California has seen an expansion to the open-source portfolio being built around the architecture as well as increased support from software vendors such as Wind River.

Siemens is combining recent acquisitions in novel ways, including one that will see a web-app development package interact more closely with Mentor's embedded offerings.

The digital-twin concept provides several avenues to achieving better safety analysis and is likely to benefit from Siemens' integration of Mentor activities.

GlobalFoundries is calling for imports of chips fabbed by TSMC into the US and Germany in multiple actions based on a list of 16 patents.

The automotive market faces challenges that make it a prime candidate for the greater use of high-level synthesis on designs with AI and ML content.

Konica Minolta describes how it has constructed a C++ signoff flow that mitigates code ambiguity, manual analysis and other inefficiencies.