Siemens and Arm combine to extend digital twin further into SoC design

By TDF Editor |  No Comments  |  Posted: January 7, 2020
Topics/Categories: Digital Twin, Blog - EDA, IP, PCB  |  Tags: , , , ,  | Organizations: , ,

Siemens and Arm are to integrate their respective digital twin and processor IP offerings for the automotive market.

Siemens PAVE 360 virtualization platform already enable the development and verification of advanced and increasingly autonomous vehicle designs. ARM’s established processor core offerings now include a range of Automotive Enhanced (AE) products that include full functional safety support.

The two companies believe their partnerships will both streamline automotive design times and the results. By enabling design from the SoC up, they argue that it will be easier to consolidate more functions across single silicon designs and also reduce board counts across the finished car.

“Siemens believes collaboration with Arm is a win for the entire industry,” said Tony Hemmelgarn, president and CEO at Siemens Digital Industries Software. “Carmakers, their suppliers, and IC design companies all can benefit from the collaboration, new methodologies and insight now sparking new innovations.”

PAVE 360 has already taken a number of ‘Best Of’ awards during 2019. It comprises the sense-compute-actuate features offered by Siemens Simcenter PreScan, the Mentor Veloce emulator, and Simcenter AMESim. A full overview of the digital twin platform and its potential for use in the design of advanced automotive SoCs can be found here.

The platform is also being demonstrated during this week’s Consumer Electronics Show in Las Vegas at the Siemens Mobility booth.

 

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