level 5


January 7, 2020

Siemens and Arm combine to extend digital twin further into SoC design

Partnership combines Siemens PAVE 360 digital twin with ARM IP, including dedicated automotive offerings, to speed and streamline design toward Level 5.
Article  |  Topics: Digital Twin, Blog - EDA, IP, PCB  |  Tags: , , , ,   |  Organizations: , ,

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