What will 3D integration look like? IEDM 2016 explored some of the options ranging from IoT sensors to advanced logic.
A licensing deal with GlobalFoundries has provided chipmaker Aquantia with the ability to speed up development of a 100Gbit/s link technology for data centers.
GlobalFoundries has introduced an embedded-MRAM option for its 22nm FD-SOI process: the 22FDX platform.
DTCO work by GlobalFoundries and Qualcomm reported at VLSI Symposia shows the need to minimize fin counts in future finFET processes.
But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
The Calibre vendor will have a strong technical presence at the leading lithography conference taking place in late February in San Jose.
GlobalFoundries has developed variants of the 28nm FD-SOI process that offer smaller die sizes and lower-power operation.
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
The FD-SOI technology developed by CEA-Leti and STMicroelectronics is beginning to gain ground as chipmakers investigate the process as a way to deliver low-energy, wireless-capable SoCs.
As plans crystallize to take FD-SOI down to 10nm, CEA-Leti argues that the technology can provide an alternative path to that of finFETs to get to 7nm processes and beyond.
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