EDA

April 29, 2015

Automotive integration led by cabling concerns, says NXP

Cabling and its weight are helping to drive integration and a shift towards wireless communication within cars, says NXP's automotive CTO.
April 28, 2015

Cadence upgrades debug for system-level era

Cadence Design Systems has launched a debug tool designed to improve the speed of bug hunting in SystemVerilog but which the company expects to grow into analog and post-silicon work.
Article  |  Tags: , , , ,   |  Organizations:
April 24, 2015

Do you need more stress (analysis) in your life?

Mentor Graphics is working on technology to analyse the effects of mechanical stress on integrated circuits, describing progress at the company's U2U conference.
April 22, 2015

Thursday returns as DAC training day

The Design Automation Conference in San Francisco this year will again feature a day of half-day training courses provided by Doulos on Thursday, June 11 .
Article  |  Tags: , , , ,   |  Organizations:
April 22, 2015

Mentor tool streamlines multi-corner parasitic extraction

Mentor Graphics has launched Calibre xACT, a tool that uses deterministic algorithms to extract parasitics from complex finFET and other nanometer processes.
April 21, 2015

Neuroprocessing to drive next wave of processor cores, says Qualcomm

Deep learning offers the next major opportunity for specialist processors, Qualcomm's Karim Arabi claimed in his keynote at Mentor Graphics’ U2U in San Jose.
Article  |  Tags: , , , , , ,   |  Organizations:
April 21, 2015

Are you ready for design for crime?

Designers will need to take crime into account as part of their design signoff process, Wally Rhines argued in his keynote at Mentor Graphics' U2U San Jose 2015 conference.
April 9, 2015

Mentor’s 2015 Valley User2User is less than two weeks away

IoT-themed keynotes from Mentor's Wally Rhines and Qualcomm's Karim Arabi headline vendor's User2User conference on April 21.
March 24, 2015

DAC 52 keynotes focus on body-worn electronics and vehicle design

The 2015 Design Automation Conference in San Francisco will feature keynotes that focus on body-worn electronics such as Google’s Smart Contact Lens and automotive issues.
Article  |  Tags: , , , ,
March 24, 2015

Mentor unites chip-to-package flow with Xpedition Package Integrator

Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.

PLATINUM SPONSORS

Synopsys Cadence Design Systems Siemens EDA
View All Sponsors