China Focus 2: The Design Dilemma
Do China's ambitions as a world-class innovator face fundamental challenges as a result of the sector's existing economic infrastructure?
Research
Capacity shortages loom if 2017 growth repeats
If current market trends persist, shortages in wafers are likely to follow, hurting the ability of some companies to ship silicon and boost the prices for those who can.
Wafer expansion hits the buffers
What's old is new: 200mm wafers are returning and driving shortages while 450mm fades into the distance.
DAC 2016 preview: Gary Smith EDA
The company's annual 'What to see' list is now available for download and highlights some of EDA's less recognized areas of innovation.
GSA on how to reinvigorate silicon business models
Open-source hardware, in-field configurability, and a hardware-plus-services approach could protect margins as the IoT hammers down costs, says GSA report.
Remembering Gary Smith
The leading EDA analyst passed away late last week after a short illness. Graham Bell offers this remembrance.
Gary Smith EDA: PCB ‘a door to the future’ but ‘slow take-off’ for ESL
The leading EDA analyst also charts growth for RTL and IC CAD in 2014 Market Share Summary, and highlights system-driven shifts in tool evaluation.
Cadence to buy Forte and build out HLS offering
EDA giant cites high-level synthesis' move into the mainstream as driven by IP integration challenges in striking deal for the HLS market leader.
Capacity may force uptick in chip prices, says analyst
Chip pricing could see a significant uptick because of reduced investment in fab capacity, according to Future Horizons.
TSMC demonstrates readiness for 3D-IC
Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.