ITC 2021 preview: Siemens Digital Industries Software

By TDF Editor |  No Comments  |  Posted: October 11, 2021
Topics/Categories: EDA - DFT, Blog - EDA  |  Tags: , , ,  | Organizations: ,

Siemens Digital Industries Software is foregrounding its packetized test technologies and introducing three DFT technologies within its Tessent family at this year’s virtual International Test Conference (October 10-15).

The packetized test focus marks the first anniversary of the company’s launch of its Tessent Streaming Scan Network technology with user case studies and further flow concepts featuring across the conference program and at Siemens virtual ITC booth.

‚ÄúPacketized test architectures form the foundation for effective, productive 3D IC test, along with industry standards such as IEEE 1838. Packetized test is also ideal for very large designs like those associated with semiconductors targeting artificial intelligence (AI) and other fast-growing applications,” said Geir Eide, director, product management for Tessent DFT products at Siemens Digital Industries Software.

The three new technologies also appearing at ITC are Reversible Scan Chain Diagnosis (RVS), Tessent SiliconInsight HP and ATPG Boost.

RVS is claimed to offer a 4X speed-up in fault diagnosis. SiliconInsight HP is tailored for new product introduction, offering, Siemens says, 30 per cent improvements in ATPG performance for SiliconInsight Desktop by up to 30 percent, pin count increases of more than 2x to 330, and support for packetized implementations. ATPG Boost is designed to enhance coverage and throughput in both hierarchical DFT approaches and traditional, flat designs as part of the TestKompress family.

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