Siemens Digital Industries Software has refreshed its collaboration with PDF Solutions with the aim of using test data and other sources to provide actionable information to improve device yield.
The aim of the collaboration is to use yield-relevant data from Siemens’ Tessent products and a broad array of other yield data sources to find correlations that are otherwise difficult to detect, and in some cases automatically.
The basis for the work are Siemens’ Tessent YieldInsight and Tessent SiliconInsight software coupled with Exensio Manufacturing Analytics from PDF. It will also use PDF’s Fire data and layout pattern analysis to create a closed loop environment from end-of-line (EOL) test back to fab wafer processing. The solution is available now through an early-access program.
“To achieve faster yield learning and new product introductions, our customers have been asking for tighter integration between different platforms across the semiconductor product lifecycle, including EDA, manufacturing analytics, and test operations,” said John Kibarian, president, CEO, and co-founder of PDF.
A webinar showcasing the collaborative benefits of Tessent and Exensio will be presented January 19, 2022. To register for the webinar, click here.