FD-SOI

December 11, 2012

Semiconductor roadmap gets fuzzier at IEDM

Semiconductor process options outlined at IEDM by Luc van den Hove of imec as industry faces hard choices and rising costs
December 10, 2012

Oxygen injection for go-faster 14nm transistors

Mears Technologies and UC Berkeley describe at IEDM 2012 how oxygen in a silicon superlattice could boost performance beyond strained silicon at 14nm.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: ,
December 4, 2012

FinFET tipsheet for IEDM

finFETs are vital to the next generation of CMOS processes from Intel, TSMC and others. How will process issues including bulk vs SOI substrates, density limitations, thickness control, and planar device integration affect their practical implementation?
October 18, 2012

ST aims to seed more interest in FD-SOI

STMicroelectronics offers 28nm process to smaller scale users through CMP and Soitec
Article  |  Topics: Blog Topics, Blog - EDA  |  Tags: , ,   |  Organizations: ,
June 11, 2012

FD-SOI to get foundry push in ST deal

A deal between GlobalFoundries and STMicroelectronics has answered the question as to where ICs based on an FD-SOI process can be made, and not just for ST.
Article  |  Topics: Blog Topics, Design to Silicon, Digital/analog implementation  |  Tags:   |  Organizations: ,
June 4, 2012

DAC2012: Can FD-SOI shrink chips, solve FinFET issue for SoCs?

What are the chances that FD SOI will become a mainstream process for future nodes?
Article  |  Topics: Commentary, Conferences  |  Tags: , ,

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