Author Archives: TDF Staff

February 6, 2019

Safety and test IP heads for automotive AI applications

Automotive AI specialist FABU has licensed a portfolio of IP from Synopsys to help assemble ISO 26262-compliant SoCs
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations:
January 21, 2019

Synopsys gets big-chip signoff boost from Innovium

Data-centre networking chip goes through full-chip design rule checking and layout-versus-schematic signoff on TSMC's 16nm finFET process in a day.
January 21, 2019

Video series details the physical verification process

Physical verification challenge of large SoCs on leading-edge processes detailed in video series
Article  |  Topics: Blog - EDA, - Verification  |  Tags: , , ,   |  Organizations:
December 31, 2018

Closing code coverage with a hardware-aware HLS-to-RTL flow

Closing code coverage from HLS has been tricky because the C++ tools were built for software not hardware. But that is changing.
Article  |  Topics: Blog Topics  |  Tags: , , , , ,   |  Organizations:
December 14, 2018

Synopsys announces DDR5 and LPDDR5 interface IP

Synopsys is targeting artificial intelligence (AI) and data centre SoCs as key application areas for the interface IP.
Article  |  Topics: Product  |  Tags: , , ,   |  Organizations: , , ,
October 29, 2018

Mentor extends Tessent for debug and automotive pattern generation

As ITC 2018 begins, Mentor addresses stringent ISO 26262 requirements and looks to bridge the gap in how IJTAG-based debug is structured.
Article  |  Topics: Tested Component to System  |  Tags: , , , ,   |  Organizations: , ,
October 9, 2018

Synopsys takes TSMC design into the cloud; IP to 7nm, 5nm and automotive processes

Synopsys is taking IC design on TSMC processes into the cloud with the launch of the Synopsys Cloud Solution, which will run on platforms from Synopsys, Amazon Web Services (AWS) or Microsoft Azure.
Article  |  Topics: Design to Silicon, Blog - EDA, IP, - Verification  |  Tags: , ,   |  Organizations: , ,
October 2, 2018

White paper outlines challenges of developing machine-learning hardware

A recent white paper from Synopsys outlines the complexities of developing hardware for use in machine-learning and artificial-intelligence (AI) systems.
Article  |  Topics: Blog Topics  |  Tags: , , ,   |  Organizations:
August 16, 2018

IBM and Synopsys to apply DTCO to post-finFET process development

Collaboration on DTCO offers IBM a better way to evaluate combinations of transistor architectures, materials and other process technology innovations using design metrics, before real wafers become available for physical experimentation.
July 30, 2018

56G Ethernet IP to enable leaf-spine hyperscale data centres

Faster PHYs needed to shift vast amounts of data around giant data centres.
Article  |  Topics: Blog - IP, - Standards  |  Tags: , ,   |  Organizations: