Author Archives: TDF Staff

Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.

Cadence and Autodesk have linked their respective cloud-based PCB and mechanical design tools.

Imperas Software has worked with AI specialist Tenstorrent to create and distribute a model of the Ascalon processor core.

The IEEE Symposium on VLSI Technology & Circuits switches back to Honolulu for its 44th year in the summer of next year and has issued its call for papers, with a deadline of early February for contributions.

The 69th annual IEEE IEDM has issued a call for papers seeking the world’s best original work in all areas of microelectronics research and development.

Siemens is integrating the Supplyframe platform with the Xpedition PCB-design software to give engineers better visibility into component availability.

Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.

Agile Analog has launched its own digital standard cell library, designed to be used in the control circuits for analog blocks that form the IP company’s main offering.

X-Fab is using IHP technology to add a 130nm silicon germanium process to its offering.

The ESD Alliance is hosting a panel and networking event at next week's colocated Design Automation Conference and SEMICON West.