Author Archives: TDF Staff

The 69th annual IEEE IEDM has issued a call for papers seeking the world’s best original work in all areas of microelectronics research and development.

Siemens is integrating the Supplyframe platform with the Xpedition PCB-design software to give engineers better visibility into component availability.

Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.

Agile Analog has launched its own digital standard cell library, designed to be used in the control circuits for analog blocks that form the IP company’s main offering.

X-Fab is using IHP technology to add a 130nm silicon germanium process to its offering.

The ESD Alliance is hosting a panel and networking event at next week's colocated Design Automation Conference and SEMICON West.

Breker's presence at next week's Design Automation Conference (DAC) will emphasize a new collaboration around the RISC-V platform.

Axiomise founder and formal expert Ashish Darbari will present across multiple events at DAC in San Francisco next week.

The tool development specialist will demonstrate its broad portfolio at next week's Design Automation Conference in San Francisco.

Primarius Technologies is making additions to its portfolio of library-design and verification tools at DAC next week.