Author Archives: TDF Staff

Real Intent has developed a tool for identifying potential security issues in chip designs at the sign-off stage.

Alphawave Semi has collaborated with Arm on the development of an advanced compute chiplet based on Arm’s Neoverse compute subsystems.

The 70th annual IEDM is putting together its next conference under the theme under the theme “shaping tomorrow’s semiconductor technology”.

Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.

Cadence and Autodesk have linked their respective cloud-based PCB and mechanical design tools.

Imperas Software has worked with AI specialist Tenstorrent to create and distribute a model of the Ascalon processor core.

The IEEE Symposium on VLSI Technology & Circuits switches back to Honolulu for its 44th year in the summer of next year and has issued its call for papers, with a deadline of early February for contributions.

The 69th annual IEEE IEDM has issued a call for papers seeking the world’s best original work in all areas of microelectronics research and development.

Siemens is integrating the Supplyframe platform with the Xpedition PCB-design software to give engineers better visibility into component availability.

Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.