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Engineering consultancy pays undisclosed sum for IMGworks division.

The 63rd IEDM has issued a call for papers for its conference in San Francisco in early December and has stuck with the later deadline introduced last year.

Japanese giant uses variable thermal simulation on automotive IC intended for harsh environments.

Among the papers at this year's VLSI Symposia in Hawaii in June, Samsung will describe a 7nm CMOS process that uses EUV lithography to tighten up device features on minimum-pitch interconnects.

Racyics has kicked off a hosted-design service to make it easier for startups and researchers to access the 22nm FD-SOI process offered by GlobalFoundries.

Can embedded projects that call for both custom hardware and software be agile? It's a question that a conference in early May organized by UK training company Feabhas sought to answer.

Hit by the loss of major client Apple, Imagination Technologies plans to sell off its MIPS and Ensigma divisions. The move signals a shift away from previous plans to diversify out from graphics processors.

NVMe is driving the SSD market thanks to its many useful features, but at least five major challenges must inform your verification plan.

DVCon China saw Mentor's chairman and CEO give a typically thorough keynote on the evolving challenges for verification.

Cadence has stripped out some of the image-processing functions of the Vision P6 and boosted the number of execution units to build a DSP aimed at deep learning.