Blog Topics

Parser specialist will highlight work with a low power startup and new features for platforms supporting UPF.

Formal, AI and UVM form key parts of the OneSpin agenda for this year's Design Automation Conference.

Vendor concentrates on memory IP products at 2017 Design Automation Conference.

An ASIC-based design has allowed Tektronix to build an oscilloscope that can mix and match analog and digital channels.

Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.

Mentor, a Siemens business, has released details on its varied activities at DAC 2017, ranging from panels to technical papers.

Cadence Design Systems has brought its chip- and PCB-design environments closer together as the shift towards multichip packages gains pace.

The vendor's experiences in enabling concurrent engineering in Xpedition Enterprise contain lessons for all design disciplines.

A year on from the last Computex and the launch of the Cortex-A73 and Mali-G71, ARM has launched a new trio of processors aimed not just at smartphones this time but servers and driver-assistance systems.

Austemper Design Systems has launched a portfolio of tools that span the development lifecycle of projects that need to demonstrate functional safety.