Blog Topics

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.

The program for the 58th Design Automation Conference, which returns to a physical format in December, is online and is running its I Love DAC promotion for free access until the end of this month.

DVCon US use a virtual platform for its event to be held in the spring and the organisers of the European event will employ a more sophisticated version of the virtual 3D space debuted last year.

All engines in the place-and-route software have been boosted with cuts to runtime and memory footprint.

Packetized test and three new technologies provide the core of the company's DFT presentations during the virtual International Test Conference running this week.

Cadence has built a unified database to support a group of tools to support the planning and implementation of 3DIC designs.

Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.

Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.

A three-pronged digital twin strategy can help aviation and defense companies master increasing complexity in electrical implementations.

Cadence has organized its machine-learning platforms into three families intended to cover a wide range of on-device AI applications.