Path to 5nm plotted at DAC panel
Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
Chipmaker
Internet of Things: an opportunity, but for whom?
Building the internet of Things will demand collaboration and a healthy ecosystem
Applications won’t find all the bugs, but they have their uses
Can applications provide useful input for verification? They can but not when run straight out of the box, panelists at DAC 2014 said.
Intel’s security architect lays out protection plan
At DAC 2014, Intel’s chief security architect Ernie Brickell described the processor maker’s approach to protecting hardware and software from hacks and attacks.
3D and EDA need to make up for Moore’s Law, says Qualcomm
Qualcomm is looking to monolithic 3D and smart circuit architectures to make up for the loss of traditional 2D process scaling as wafer costs for advanced nodes continue to increase.
Remember 20nm? Qualcomm does
Qualcomm will present at VLSI Technology Symposium 2014 a version of TSMC's 20nm technology that uses design and process tweaks to reduce the number of double-patterned layers.
Chipmaking’s future: all of the nodes all of the time
The stall in Moore's Law caused by the rapid rise in cost of the advanced processes will shift more innovation to mature nodes Monday keynoters at DAC said.
Samsung certifies Synopsys tools, IP at 14nm
Samsung, Synopsys and ARM have been working together to create a finFET design ecosystem.
Post-silicon devices: maybe it’s in the way they move
A research-focused session at DAC 2014 looks at using coupled oscillators rather than charge transfer to process data.
IP takes center stage in push towards systems engineering
At DAC 2014, some 30 per cent of exhibitors are IP suppliers, offering design services or both, demonstrating how system-level design is about building on what has gone before.