Chipmaker

Gold Standard Simulations has run simulations to work out how much of an improvement Intel's new rectangular shape represents.

Design for the 20nm generation of processes has revealed power and clocking issues for the two major FPGA manufacturers presentations at Hot Chips revealed.

Despite the swirl of interest in the internet of things progress is likely to be held back by interoperability issues according to speakers at the recent NI Week conference.

National Instruments plans to build an ecosystem around semiconductor test that could provide a missing link between the design process and production.

FinScale has developed a design and process recipe for a finFET structure that the company claims is easier to make but which provides better performance than existing approaches.

With an eye on the markets for wearables and the internet of things (IoT), digital signal processing specialist IP company CEVA has bought RivieraWaves, a France-based supplier of WiFi and Bluetooth cores, in a deal worth an expected $19m.

Chinese foundry Semiconductor Manufacturing International Corporation (SMIC) is to get a helping hand to develop a production-class 28nm process from Qualcomm Technologies.

STMicroelectronics is using the OpenPDK standard from Si2 to speed up the production and delivery of process design kits (PDKs) and asks for wider adoption by foundries.

With the aim of accelerating the development of applications and algorithms that harness sensor fusion, startup Sensor Platforms has released as open source its Open Sensor Platform (OSP).

At the VLSI Technology Symposium a team led by STMicroelectronics described the techniques used for the upcoming 14nm FD-SOI to boost speed and density over the 28nm version.