automotive

September 30, 2019

Arm TechCon 2019 preview: Mentor

Mentor is active across the program at Arm TechCon with a range of conference and booth talks, demonstrations and presentations.
Article  |  Topics: Blog - EDA, Embedded, IP  |  Tags: , , , , , , ,   |  Organizations: ,
September 23, 2019

Automating wire-harness development

Harness manufacture in automotive remains manually intensive but model-based engineering provides a way to streamline the processes to make them more efficient, a Mentor white paper claims.
Article  |  Topics: Blog - Electrical Design, PCB  |  Tags: , , ,   |  Organizations:
August 6, 2019

Increased cooperation seen as vital for automotive safety verification

Safety verification calls for increased collaboration across the supply chain, experts say. The challenge is finding ways to make that happen.
June 3, 2019

Analyst: China’s foreign EDA thirst to grow despite trade tensions

Analyst Rich Valera points to China as a major source of EDA tool growth despite short-term tensions with the US government.
May 27, 2019

Automotive complexity drives DFT to the RTL

Design-for-test can no longer be left until the gate level for increasingly sensitive designs aimed at newer processes.
Article  |  Topics: Blog - EDA, - Tested Component to System  |  Tags: , , , ,   |  Organizations:
May 20, 2019

DAC 2019 preview: Mentor

Mentor is active across the program and its main and Verification Academy booths within the exhibition in Las Vegas.
April 12, 2019

DesignWare gets automotive boost with GLOBALFOUNDRIES 22FDX SOI qualification

Synopsys and GLOBALFOUNDRIES are developing a portfolio of automotive IP for the chipmaker’s 22nm fully depleted silicon-on-insulator (22FDX) process.
Article  |  Topics: Blog - IP  |  Tags: , , , ,
March 12, 2019

Mastering automotive complexity through generative design

The trend toward Level 5 fully autonomous vehicles poses major complexity, cost and change issues that Generative Design flows aim to address.
July 12, 2018

With RF, power and MRAM, FD-SOI finds its role

FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , , , ,   |  Organizations: , , ,
June 27, 2018

EDA needs to work on the back end, says Qualcomm

It’s the back-end that needs work as system-level considerations begin to dominate design, Qualcomm’s vice president of engineering said at DAC.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , , ,   |  Organizations:

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