Cadence adds floating point to Fusion
Cadence Design Systems has added floating-point to its latest core intended for embedded signal processing.
automotive
NXP readies single package solution for 77GHz radar
NXP discusses second silicon flavor for automotive radar, after earlier launch of postage-stamp devices.
Mentor integrates automotive IGBT test and simulation
A new dedicated automotive power tester helps cut simulation errors to just 0.5% with more faithful calibration.
53rd DAC conference program announced
The 53rd Design Automation Conference has published its program for the upcoming event in Austin, Texas, which will include keynotes from AMD, nVidia, and NXP Semiconductors and tracks that connect electronics to biology.
X-Fab aims at lower-cost SiC with upgraded 6in line
X-Fab Silicon Foundries has upgraded its 6in fab in Lubbock, Texas to handle silicon carbide wafers in parallel with existing silicon production.
Three key ways to reduce silicon test costs
Mentor's Greg Aldrich describes how test's market leader is driving down cost in the billion-gate era by rethinking and extending existing technologies
DVCon Europe: Getting TLM to cope with proliferating ECUs and serial protocols
High powered alliance develops TLM standards to address growing automotive and IoT concerns.
Expanding role of UVM takes center stage at DVCon Europe
Tech Design Forum talked to the general and program chairs of DVCon Europe about the conference and how it seeks to show the expansion of IC verification methodologies to the system level.
X-Fab updates 180nm SOI process for automotive and industrial applications
Foundry claims isolation and device integration advantages for 180nm SOI process, help to absorb extra costs of SOI wafers
Synopsys speeds automotive SoC qualification with IP launch
Synopsys develops portfolio of ASIL B ready IP, and invests in AEC-Q100 testing and TS 16949 quality management, to ease automotive SoC qualification.
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