3D integration technologies will blend says TSMC chief scientist
DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday
Author Archives: Chris Edwards
Mentor tunes LVS for early SoC integration
Mentor has released a tool that attempts to deal with the problems encountered in the use of physical circuit verification in the early stages of SoC integration.
Perforce buys Methodics
Version-control specialist Perforce Software has bought Methodics, which focuses on the lifecycle and traceability management of semiconductor IP.
Verifyter offers regression analysis for six months free
At DAC this week, Verifyter is offering a limited number of companies free six-month licences of its regression-analysis tool Pindown.
Heterogeneous integration calls for new approaches
Heterogeneous integration has the potential to overcome the yield and cost challenges presented by the growing headwinds associated with process scaling. But it may take a dramatic rethink in design approaches.
Scaling costs tip balance toward chiplets for AMD server processors
In a panel session at VLSI Symposia, AMD described how the economics have come down strongly in favor of multichip integration for multicore server processors.
Arm returns to its roots
Arm is to return to focusing on semiconductor IP following the decision to spin out its IoT operations to separate groups within the Softbank empire.
DVCon Europe goes virtual
The organizers of DVCon Europe have decided to turn the autumn verification conference into a virtual event this year.
Sigasi creates SDK for custom editors
Sigasi has launched a software kit to provide inhouse tools builders and EDA vendors with a way to build in code-editing features.
IEDM switches to virtual format for 2020
The organizers of the 66th annual IEDM have decided to hold the December conference virtually.